Abstract:

My talk has two parts. The first part will address my work at Cisco and my activities in NATEA and IEEE. The second part will connect the first part to the main theme of this talk based on my proven track record in career development and hope my talk can provide a way to inspire the young generation to find a prosperous career in the age of AI.

Bio:

Dr. Rockwell Hsu (徐名璋) is a Technical Lead at Cisco Systems, Inc. Most recently, he is with data center server group working on new UCS-X servers for enterprise’s advanced and generative AI workloads and secure AI infrastructure. He led an initiative on advanced semiconductor packaging development for 112Gbps per lane PAM4 signaling for 800GE network equipment and SI/PI development for network line cards and fabric cards used in switches and routers. Prior to Cisco, he was the very first RF packaging engineer to drive Intel’s RF packaging technology roadmap for WiFi devices and led server CPU packaging development at Intel, RF packaging design for UWB RFIC at WiLinx, Bluetooth product development at KC Technology, and satellite antenna design at Space System/Loral for Intelsat and Globalstar satellite.

Dr. Hsu has been the co-chair of Internet of Things Technical Working Group of IEEE Heterogeneous Integration Roadmap since 2021 and a committee member of High Performance Computing & Data Center TWG since 2017.

Dr. Hsu served as an industry advisor for U.S. National Science Foundation’s Convergence Accelerator – 2022 Cohort, Track I.

Dr. Hsu is an industry advisor and committee member of Florida Semiconductor Institute and was Thrust 4 committee member of Southeastern Consortium for Assured and Leading-Edge Semiconductors (SCALES).

Dr. Hsu has been a committee member of DesignCon Technical Program Committee since 2017.

Dr. Hsu has been a technical committee member of the High-Speed, Wireless & Components Committee for the IEEE Electronic Component Technology Conference (ECTC) since 2006 and was the committee chair in 2010 –2012.

Dr. Hsu was the Headquarters President of North America Taiwanese Engineering & Science Association (NATEA, 北美台灣工程師協會) in 2020 –2021, 2018/09 – 2019, and President of Silicon Valley Chapter in 2016.

Dr. Hsu was the chair of Santa Clara Valley Chapter of the IEEE Antennas and Propagation Society (APS) in 1998 –1999.

Dr. Hsu received IEEE Third Millennium Medal Award in 2000.

Dr. Hsu held one US patent with Intel for semiconductor packaging.

Dr. Hsu received his Bachelor of Science in Applied Physics from Tamkang University, Master of Science in Computer Engineering and Ph.D. in Electrical Engineering both from Florida Institute of Technology, focusing on the electromagnetic field theory, antenna design, and microwave engineering.